Hostname: page-component-68c7f8b79f-m4fzj Total loading time: 0 Render date: 2026-01-05T19:54:57.320Z Has data issue: false hasContentIssue false
  • English
  • Français

Multi-beam SEM Technology for High Throughput Imaging

Published online by Cambridge University Press:  18 May 2016

Kyle Crosby ,
Anna Lena Eberle  and
Dirk Zeidler
Kyle Crosby*
Affiliation:
Carl Zeiss Microscopy, LLC, 1 Zeiss Drive, Thornwood, NY 10594, U.S.A.
Anna Lena Eberle
Affiliation:
Carl Zeiss Microscopy, GmbH, Carl-Zeiss-Straße 22, 73447 Oberkochen, Germany
Dirk Zeidler
Affiliation:
Carl Zeiss Microscopy, GmbH, Carl-Zeiss-Straße 22, 73447 Oberkochen, Germany
*
*(Email: kyle.crosby@zeiss.com)
Get access

Abstract

Recent developments in a number of fields call for high-throughput, high-resolution imaging of large areas. Examples are reconstruction of macroscopic volumes of mouse brain tissue, or wafer defect inspection. To address these needs, we have developed a multi-beam, single column SEM which utilizes an array of 61 or 91 electron beams and detectors in parallel. The total possible detection speed of the multiple beam SEM is the single detection speed times the number of beams. In the same time a single beam SEM creates an image of several million pixels size, the multi-beam SEM produces between several hundred million and one billion pixels. Herein we demonstrate the capabilities of generating massive data sets using the multi-beam SEM on a variety of samples including brain tissue serial sections and semiconductor test wafers.

Keywords

scanning electron microscopy (SEM)defectsnanostructure

Information

Type
Articles
Information
MRS Advances , Volume 1 , Issue 26: Theory, Characterization, and Modeling , 2016 , pp. 1915 - 1920
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

Mikula, S., Denk, W., “High-resolution whole-brain staining for electron microscopic circuit reconstruction,” Nature Methods, 12, 541–546 (2015), [doi:10.1038/nmeth.3361].Google Scholar
Ai-Awami, A.K. et al. ., “NeuroBlocks – Visual Tracking of Segmentation and Proofreading for Large Connectomics Projects,” IEEE Trans Vis Comput Graph., 22, 738–746, (2015), [doi:10.1109/TVCG.2015.2467441].Google Scholar
Marx, V., “Neurobiology: Brain Mapping in High Resolution,” Nature, 503, 147–152 (2013), [doi:10.1038/503147a].Google Scholar
Malloy, M., et al. ., “Massively Parallel E-Beam Inspection: Enabling next-generation patterned defect inspection for wafer and mask manufacturing”, Proc. SPIE 9423, (2015), [doi:10.1117/12.2175535].Google Scholar
Thiel, B. et al. ., “Assessing the viability of multi-electron beam wafer inspection for sub-20nm defects,” Proc. SPIE 9236, (2014), [doi:10.1117/12.2069302].Google Scholar
Keller, A. L., Zeidler, D. and Kemen, T., “High throughput data acquisition with a multi-beam SEM,” Proc. SPIE 9236, (2014), [doi:10.1117/12.2069119].Google Scholar
Kemen, T., et al. . “Further advancing the throughput of a multi-beam SEM”, Proc. SPIE 9424, (2015), [doi:10.1117/12.2188560].Google Scholar
Eberle, A.L., et al. . “High-resolution, high-throughput imaging with a multibeam scanning electron microscope”, J Microsc, (2015), [doi:10.111/jmi.12224].Google Scholar
Eberle, A.L., et al. . “Multiple-Beam Scanning Electron Microscopy”, Microscopy Today, (2015), [doi:10.1017/S1551929515000012].CrossRefGoogle Scholar
Kemen, T., Garbowski, T. and Zeidler, D., “Multi-beam SEM Technology for ultra-high Throughput”, Proc. SPIE 9658, (2015), [doi: 10.1117/12.2195705].Google Scholar
Kasthuri, N. et al. ., “Saturated Reconstruction of a Volume of Neocortex”, Cell 162, (2015), [doi: 10.1016/j.cell.2015.06.054]Google Scholar